DocumentCode :
2733188
Title :
ESD field coupling study in relation with PCB GND and metal chassis
Author :
Lee, Jong-Sung ; Pommerenke, David ; Lim, Jae-Deok ; Seol, Byong-Su
Author_Institution :
SamSung Electron. Manuf. Technol. R&D Center, Suwon
fYear :
2009
fDate :
12-16 Jan. 2009
Firstpage :
153
Lastpage :
156
Abstract :
This work demonstrates a simple experimental setup to measure ESD-induced voltage to traces on a printed circuit board when ESD current is injected directly onto the outside of a metal case and presents how the induced voltage can be affected by the physical structure of the PCB ground and the metal case. The correlation between ESD-induced voltage and the method of connecting the PCB and chassis grounds shall be discussed, as well as how the PCB ground fill affects ESD. These experimental results may provide guidance for a better design for ESD immunity.
Keywords :
electrostatic discharge; printed circuits; ESD current; ESD field coupling study; ESD-induced voltage; PCB ground; metal chassis; printed circuit board; Circuit testing; Coaxial cables; Computer aided manufacturing; Copper; Couplings; Electrostatic discharge; Joining processes; Oscilloscopes; Research and development; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 2009 20th International Zurich Symposium on
Conference_Location :
Zurich
Print_ISBN :
978-3-9523286-4-4
Type :
conf
DOI :
10.1109/EMCZUR.2009.4783413
Filename :
4783413
Link To Document :
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