Title :
Finite element analysis of microelectronic components-state of the art
Author :
Schaller, Andreas
Author_Institution :
Dataid-AS&I, Fontenay Sous Bois
Abstract :
The finite-element method has proven very effective in a variety of analyses in the electronics areas. As the components become more and more complex and are packed closer together in smaller volumes, the heat and vibration environments become more intense. Powerful general-purpose programs such as the ANSYS package that use the finite-element method provide engineers with a valuable simulation tool available on a wide range of computers, from PCs for linear statics and dynamics to supercomputers for 3-D fluid-flow analyses. The use of ANSYS is described for board-level simulation and analysis of free convection heat transfer in packaging
Keywords :
circuit analysis computing; convection; digital simulation; electronic engineering computing; finite element analysis; packaging; printed circuit design; software packages; ANSYS package; PCB analysis; board-level simulation; finite-element method; free convection heat transfer; microelectronic components; packaging; simulation tool; Analytical models; Computational modeling; Computer simulation; Electronics packaging; Finite element methods; Fluid dynamics; Microelectronics; Personal communication networks; Power engineering and energy; Power engineering computing;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International
Conference_Location :
Neuilly sur Seine
DOI :
10.1109/EEMTS.1988.75954
