DocumentCode :
2733409
Title :
Atomistic simulations of heat transfer at carbon nanotube/Si interfaces
Author :
Cao, Ajing ; Qu, Jianmin ; Yao, Matthew
Author_Institution :
Civil & Environ. Eng., Northwestern Univ., Evanston, IL, USA
fYear :
2010
fDate :
1-4 June 2010
Firstpage :
417
Lastpage :
420
Abstract :
Molecular dynamics simulations are used to compute the thermal conductance at the interface between an open-end single-wall carbon nanotube and a Si substrate for different CNT lengths and temperature. It is found that the thermal conductance at the CNT/Si interface increases with increasing temperature up to 1200K. The enhanced phonon transfer at higher temperatures is mainly due to the anharmonicity at the interfaces. Strong thermal and mechanical coupling is also observed, i.e., the thermal conductance at the CNT/Si interface is dependent on the contact pressure at the interface.
Keywords :
carbon nanotubes; heat transfer; molecular dynamics method; thermal conductivity; C-Si; Si; Si substrate; atomistic simulations; carbon nanotube-Si interfaces; enhanced phonon transfer; heat transfer; mechanical coupling; molecular dynamics simulations; thermal conductance; thermal coupling; Carbon nanotubes; Conducting materials; Heat transfer; Phase change materials; Phonons; Slabs; Temperature; Thermal conductivity; Thermal management; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th
Conference_Location :
Las Vegas, NV
ISSN :
0569-5503
Print_ISBN :
978-1-4244-6410-4
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2010.5490940
Filename :
5490940
Link To Document :
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