Signal Integrity Ensured Through Impedance Characterization of Advanced High-Speed Design

Author

Amedeo, Alexandre ; Gautier, Cyrille ; Costa, Francois ; Bernard, Laurent

Author_Institution

Thales Commun., Land & Joint Syst., Colombes

fYear

2009

fDate

12-16 Jan. 2009

Firstpage

249

Lastpage

252

Abstract

It is increasingly important to use Controlled Impedance for manufacturing High-Speed and high density-interconnect (HDI) printed circuit board (PCB). Furthermore, signal integrity (SI) tools are required to prevent and reduce most of impedance mismatch and crosstalk problems. This paper presents the impedance characterization of PCB traces, created in an industrial context. From the first specifications to Time domain Reflectometer (TDR) measurements in PCB, we describe the differences between calculated impedances in layer stack, coupon and micro-section analysis. Besides, the impact of Net geometry on characteristic impedance is evaluated through both 2D and 3D simulations.

Keywords

integrated circuit interconnections; printed circuit design; printed circuits; advanced high-speed design; controlled impedance; high density-interconnect printed circuit board; high-speed interconnect printed circuit board; impedance characterization; micro-section analysis; time domain reflectometer measurements; Communication system control; Control systems; Degradation; Dielectric losses; Impedance measurement; Manufacturing; Permittivity; Printed circuits; Signal design; Velocity measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2009 20th International Zurich Symposium on

Conference_Location

Zurich

Print_ISBN

978-3-9523286-4-4

Type

conf

DOI

10.1109/EMCZUR.2009.4783437

Filename

4783437