DocumentCode :
2733611
Title :
Practical challenges of achieving high efficiency boron back surface field solar cells
Author :
Das, A. ; Ramanathan, S. ; Upadhyaya, A. ; Meemongkolkiat, V. ; Rohatgi, A.
Author_Institution :
Univ. Center of Excellence for Photovoltaic Res. & Educ., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2010
fDate :
20-25 June 2010
Abstract :
This work examines two challenges facing the commercialization of boron diffused crystalline silicon solar cells - unintentional iron contamination and the passivation of a textured boron diffused surface. We find that when Fe is introduced into silicon wafers by boron diffusion, the Fe often remains trapped in the boron surface layer and undetectable using bulk lifetime measurements. However this trapped Fe is still a threat to bulk lifetime since subsequent thermal processes can inject this Fe into the bulk. Importantly, POCl3 appears to be ineffective at gettering the trapped Fe; POCl3 gettering works only when the trapped Fe is injected into the bulk prior to POCl3 deposition. An alternate strategy is to directly getter the trapped Fe by using a negatively charged dielectric that is placed on the boron diffused surface. Random pyramid texturing was found to be detrimental to the spin-on SiO2 induced passivation of a boron doped surface. This passivation loss can be minimized by removing the texture with a KOH etch and ~650 mV VOC could be achieved on both FZ and Cz material.
Keywords :
boron; chemical vapour deposition; grain boundary diffusion; passivation; silicon; solar cells; POCl3; SiO2:B; boron back surface field solar cells; boron diffusion; crystalline silicon solar cells; deposition; dielectric; iron contamination; passivation; silicon wafers; surface texturing; Boron; Dielectrics; Iron; Passivation; Silicon; Surface texture;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2010 35th IEEE
Conference_Location :
Honolulu, HI
ISSN :
0160-8371
Print_ISBN :
978-1-4244-5890-5
Type :
conf
DOI :
10.1109/PVSC.2010.5614151
Filename :
5614151
Link To Document :
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