DocumentCode
2733623
Title
DC and AC NBTI Stresses in PMOSFETs with PE-SiN Capping
Author
Lu, Chia-Yu ; Lin, Horng-Chih ; Chang, Yi-Feng ; Huang, Tiao-Yuan
Author_Institution
Dept. of Electron. Eng. & Inst. of Electron., Nat. Chiao Tung Univ., Hsinchu
fYear
2006
fDate
26-30 March 2006
Firstpage
727
Lastpage
728
Abstract
PMOS negative bias temperature instability (NBTI) is known to be a critical reliability concern and represents one of the major bottlenecks for product lifetime (Ogawa et al., 1995) and (La Rosa et al., 1997). It had also been shown that the device lifetime under dynamic stress could be much longer than that under static stress (Chen et al., 2003). Recently, using process technique to induce uniaxial strain in the channel (Ootsuka et al., 2000) and (Mistry et al., 2004) has received a lot of attention. However, the NBTI issue of these strained devices has not been carefully addressed. In this work, we investigate the static and dynamic NBTI of pMOSFETs with compressively strained channel
Keywords
MOSFET; phosphorus compounds; semiconductor device reliability; silicon compounds; stability; stress effects; AC negative bias temperature instability stresses; DC negative bias temperature instability stresses; PMOSFET; SiN; capping; critical reliability concern; device lifetime; dynamic stress; product lifetime major bottleneck; static stress; strained devices; uniaxial strain; Capacitive sensors; Compressive stress; Degradation; MOSFETs; Niobium compounds; Reliability engineering; Silicon compounds; Strain control; Stress control; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location
San Jose, CA
Print_ISBN
0-7803-9498-4
Electronic_ISBN
0-7803-9499-2
Type
conf
DOI
10.1109/RELPHY.2006.251345
Filename
4017286
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