• DocumentCode
    2733623
  • Title

    DC and AC NBTI Stresses in PMOSFETs with PE-SiN Capping

  • Author

    Lu, Chia-Yu ; Lin, Horng-Chih ; Chang, Yi-Feng ; Huang, Tiao-Yuan

  • Author_Institution
    Dept. of Electron. Eng. & Inst. of Electron., Nat. Chiao Tung Univ., Hsinchu
  • fYear
    2006
  • fDate
    26-30 March 2006
  • Firstpage
    727
  • Lastpage
    728
  • Abstract
    PMOS negative bias temperature instability (NBTI) is known to be a critical reliability concern and represents one of the major bottlenecks for product lifetime (Ogawa et al., 1995) and (La Rosa et al., 1997). It had also been shown that the device lifetime under dynamic stress could be much longer than that under static stress (Chen et al., 2003). Recently, using process technique to induce uniaxial strain in the channel (Ootsuka et al., 2000) and (Mistry et al., 2004) has received a lot of attention. However, the NBTI issue of these strained devices has not been carefully addressed. In this work, we investigate the static and dynamic NBTI of pMOSFETs with compressively strained channel
  • Keywords
    MOSFET; phosphorus compounds; semiconductor device reliability; silicon compounds; stability; stress effects; AC negative bias temperature instability stresses; DC negative bias temperature instability stresses; PMOSFET; SiN; capping; critical reliability concern; device lifetime; dynamic stress; product lifetime major bottleneck; static stress; strained devices; uniaxial strain; Capacitive sensors; Compressive stress; Degradation; MOSFETs; Niobium compounds; Reliability engineering; Silicon compounds; Strain control; Stress control; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7803-9498-4
  • Electronic_ISBN
    0-7803-9499-2
  • Type

    conf

  • DOI
    10.1109/RELPHY.2006.251345
  • Filename
    4017286