Chip-Package Co-modeling & Verification of Noise Coupling & Generation in CMOS DC/DC Buck Converter

Author

Song, Taigon ; Kim, Jiseong ; Pak, Junso ; Kim, Joungho

Author_Institution

Dept. of EECS, Korea Adv. Inst. of Sci. & Technol., Daejeon

fYear

2009

fDate

12-16 Jan. 2009

Firstpage

285

Lastpage

288

Abstract

DC/DC Converters are now an essential part in a system due to the various needs of supply voltage that is necessary for different circuits in the system. However, there are many papers which have dealt for efficiency or for a novel structure that would be customized to the specific design, but few dealt with the noise characteristics of DC/DC converters which could critically affect to the output supply voltage the target circuit would need. In this paper we analyzed the effect of noise to a DC/DC Converter in a chip-package co-design. We figured out that the decoupling capacitors on the PCB board cannot shield all the noise that could affect to the DC/DC converter, and on-chip decoupling capacitor for a DC/DC Converter would be necessary.

Keywords

CMOS integrated circuits; DC-DC power convertors; integrated circuit design; integrated circuit packaging; CMOS DC-DC buck converter; PCB board; chip-package comodeling; noise coupling verification; on-chip decoupling capacitors; Buck converters; CMOS technology; Capacitors; Circuit noise; DC generators; DC-DC power converters; Noise generators; Packaging; Switches; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2009 20th International Zurich Symposium on

Conference_Location

Zurich

Print_ISBN

978-3-9523286-4-4

Type

conf

DOI

10.1109/EMCZUR.2009.4783446

Filename

4783446