• DocumentCode
    2734066
  • Title

    Computer simulation of stress analysis in benzocyclobutene (BCB) based neural interface

  • Author

    Yun, Wenjun ; Singh, Amarjit ; He, Jiping ; Lee, Kee-Keun ; Kim, Bruce

  • Author_Institution
    Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
  • Volume
    4
  • fYear
    2003
  • fDate
    17-21 Sept. 2003
  • Firstpage
    3407
  • Abstract
    Computer simulation was performed using finite element analysis (FEA) to analyze stress profile in a neural probe made of benzocyclobutene (BCB) polymer with a thin silicon backbone layer. The probe is made up of three distinct sections. Sections 1 and 2 have a silicon backbone layer on the BCB to provide adequate stiffness required for easy handling during surgery (insertion and fixation), while section 3 is totally flexible. The simulation results indicate that the stress points are always buildup on the interface of stiff sections 1 and 2. The probe is more likely to fail at these interface points during handling if bending occurs. Increasing the length of section 1 significantly lowers the stress level. Further, 5 μm silicon backbone layer depicted lower stress level, in the present design.
  • Keywords
    bioelectric phenomena; biomedical electrodes; elemental semiconductors; finite element analysis; polymers; probes; silicon; simulation; stress analysis; surgery; 5 micron; Si; benzocyclobutene; computer simulation; finite element analysis; neural interface; polymer; silicon backbone layer; stiffness; stress analysis; stress profile; surgery; Computer simulation; Electrodes; Finite element methods; Microelectrodes; Performance analysis; Probes; Silicon; Spine; Stress; Surgery;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2003. Proceedings of the 25th Annual International Conference of the IEEE
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-7789-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.2003.1280877
  • Filename
    1280877