DocumentCode
2734066
Title
Computer simulation of stress analysis in benzocyclobutene (BCB) based neural interface
Author
Yun, Wenjun ; Singh, Amarjit ; He, Jiping ; Lee, Kee-Keun ; Kim, Bruce
Author_Institution
Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
Volume
4
fYear
2003
fDate
17-21 Sept. 2003
Firstpage
3407
Abstract
Computer simulation was performed using finite element analysis (FEA) to analyze stress profile in a neural probe made of benzocyclobutene (BCB) polymer with a thin silicon backbone layer. The probe is made up of three distinct sections. Sections 1 and 2 have a silicon backbone layer on the BCB to provide adequate stiffness required for easy handling during surgery (insertion and fixation), while section 3 is totally flexible. The simulation results indicate that the stress points are always buildup on the interface of stiff sections 1 and 2. The probe is more likely to fail at these interface points during handling if bending occurs. Increasing the length of section 1 significantly lowers the stress level. Further, 5 μm silicon backbone layer depicted lower stress level, in the present design.
Keywords
bioelectric phenomena; biomedical electrodes; elemental semiconductors; finite element analysis; polymers; probes; silicon; simulation; stress analysis; surgery; 5 micron; Si; benzocyclobutene; computer simulation; finite element analysis; neural interface; polymer; silicon backbone layer; stiffness; stress analysis; stress profile; surgery; Computer simulation; Electrodes; Finite element methods; Microelectrodes; Performance analysis; Probes; Silicon; Spine; Stress; Surgery;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2003. Proceedings of the 25th Annual International Conference of the IEEE
ISSN
1094-687X
Print_ISBN
0-7803-7789-3
Type
conf
DOI
10.1109/IEMBS.2003.1280877
Filename
1280877
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