A 10 μm thick RF-ID tag for chip-in-paper applications

Author

Dekker, R. ; Dumling, M. ; Fock, J.-H. ; Gourhant, O. ; Jonville, C. ; Michielsen, T.M. ; Pohlmann, H. ; Schnitt, W. ; Tombeur, A.M.H.

Author_Institution

Philips Res., Eindhoven, Netherlands

fYear

2005

fDate

9-11 Oct. 2005

Firstpage

18

Lastpage

21

Abstract

In CIRCONFLEX technology, circuits fabricated on SOI wafers are transferred to a 10 μm thick polyimide carrier. The highly flexible circuits remain defect free even after bending to radii of less than 1 mm, making them attractive for chip-in-paper applications. The effect of bending on the transistors characteristics is very small as demonstrated in this paper. A fully autonomous RF-ID tag demonstrator circuit with integrated antenna, fabricated in CIRCONFLEX technology is presented. The 3×3 mm² tag operates up to 1.5 cm from the base station, and continues to function even while bent to a radius of 0.7 mm.

Keywords

antennas; flexible electronics; radiofrequency identification; radiofrequency integrated circuits; silicon-on-insulator; 10 micron; CIRCONFLEX technology; RF-ID tag demonstrator circuit; base station; chip-in-paper applications; highly flexible circuits; integrated antenna; silicon-on-insulator wafers; thick polyimide carrier; transistors characteristics; Application specific integrated circuits; Blades; Data security; Flexible printed circuits; Glass; Integrated circuit technology; Polyimides; Silicon on insulator technology; Substrates; Technical Activities Guide -TAG;

fLanguage

English

Publisher

ieee

Conference_Titel

Bipolar/BiCMOS Circuits and Technology Meeting, 2005. Proceedings of the

Print_ISBN

0-7803-9309-0

Type

conf

DOI

10.1109/BIPOL.2005.1555192

Filename

1555192