Title :
Mechanism Analysis of Process Parameters Effects on Bondability in Ultrasonic Ball Bonding
Author :
Qi, Jun ; Hung, Ngar Chun ; Li, Ming ; Liu, Deming
Author_Institution :
ASM Assembly Automation Ltd. 4/F., Watson Center, Kwai Chung, Hong Kong. email: jqi@asmpt.com
Abstract :
Optimization of ultrasonic bonding process is a time consuming work and still remains a great technological challenge in microelectronic packaging industry due to poor understanding of the mechanism of process parameters effects. In this work, ultrasonic gold ball bonding on aluminum pad was carried out to study the effect of process parameters including bonding power and bonding force on bondability and bond pattern. The evolution of bond pattern and slip area was attributed to the variation of bondability. It is shown that the effects of process parameters on bondability can be explained by the mechanism proposed in this study.
Keywords :
Aluminum; Bonding forces; Bonding processes; Force measurement; Gold; Microelectronics; Semiconductor device packaging; Surface contamination; Temperature; Wafer bonding;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
Print_ISBN :
0-7803-9292-2
Electronic_ISBN :
0-7803-9293-0
DOI :
10.1109/HDP.2005.251374