• DocumentCode
    2734203
  • Title

    Synchronization Trigger System Design of the Thermosonic Flip-chip Bonding

  • Author

    Jian-Ping, Li ; Jun-ya, Huo ; Fu-liang, Wang ; Lei, Han ; Jue, Zhong

  • Author_Institution
    Coll. of Mech. & Electr. Eng., Central South Univ., Changsha
  • fYear
    2005
  • fDate
    27-29 June 2005
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The stability and the delay time of the scan working model trigger system and the interrupt working model trigger system were compared and studied by the experiment of synchronization trigger of the thermosonic flip-chip bonding. It is found that the interrupt working model trigger system´s stability was better than the scan working model trigger system´s. It´s biggest delay time, average delay time and the standard deviation of the delay time were all shorter than the scan working model trigger system´s, especially the standard deviation just as small as 0.5mus. The result indicates that the delay time of the interrupt working model trigger system is 9mus less than a time cycle of the thermosonic and it´s every time´s delay time is invariableness. The interrupt working model trigger system is superior to the scan working model trigger system. It is also confirmed that the interrupt working model trigger system can used as a precise synchronization trigger system by triggering the thermosonic flip-chip bonding´s data acquisition system, the press measure system and the polytec vibration measure system
  • Keywords
    data acquisition; delays; flip-chip devices; lead bonding; stability; data acquisition system; delay time; interrupt working model; polytec vibration measure system; press measure system; scan working model; synchronization trigger system; thermosonic flip-chip bonding; trigger system design; trigger system stability; Bonding; Current measurement; Data acquisition; Delay effects; Delay systems; Joining processes; Time measurement; Vibration measurement; Voltage; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    0-7803-9292-2
  • Electronic_ISBN
    0-7803-9293-0
  • Type

    conf

  • DOI
    10.1109/HDP.2005.251377
  • Filename
    4017418