Adhesion Study of Copper Layer Deposited onto Liquid Crystalline Polymer for Electronic Packaging

Author

Zhang, Qi ; Nyborg, Lars ; Jelvestam, Urban ; Lai, Zonghe ; Cheng, Zhaonian ; Liu, Johan

Author_Institution

Swedish Microsystem Integration Technol. Center, Shanghai Univ.

fYear

2005

fDate

27-29 June 2005

Firstpage

1

Lastpage

6

Abstract

The adhesion of copper/liquid-crystalline polymer bilayer lamination structures with various thickness fabricated with chemical electroless copper deposition (CECD) and surfaced activated bonding (SAB) were characterized mechanical shear-off tests. The influence on the surface morphology and chemical state during different processes, including sulfuric acid bath, heat treatments, plasma treatments and moisture aging processes are studied with X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SAM). Thus the two fabrication methods are compared and potential methods to intensify the adhesion strength are present. The results are valuable for the future work aimed at achieving a LCP substrate based system-in-a-packaging (SiP) fabrication flow

Keywords

X-ray photoelectron spectra; adhesion; adhesive bonding; copper; electroless deposition; electronics packaging; heat treatment; liquid crystal polymers; scanning electron microscopy; surface morphology; system-in-package; LCP substrate; X-ray photoelectron spectroscopy; adhesion study; bilayer lamination structures; chemical electroless copper deposition; chemical state; copper layer; electronic packaging; heat treatments; liquid crystalline polymer; mechanical shear-off tests; moisture aging processes; plasma treatments; scanning electron microscopy; sulfuric acid bath; surface morphology; surfaced activated bonding; system-in-a-package; Adhesives; Chemicals; Copper; Crystallization; Electronics packaging; Fabrication; Lamination; Liquid crystal polymers; Surface morphology; Surface treatment; X-ray photoelectron spectroscopy; adhesion; liquid-crystalline polymers; plasma;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on

Conference_Location

Shanghai

Print_ISBN

0-7803-9292-2

Electronic_ISBN

0-7803-9293-0

Type

conf

DOI

10.1109/HDP.2005.251384

Filename

4017425