DocumentCode
2734361
Title
An Ontology for Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications
Author
Morris, James E. ; Lee, Jeahuck ; Liu, Johan
Author_Institution
Dept. of Electr. & Comput. Eng., Portland State Univ., OR
fYear
2005
fDate
27-29 June 2005
Firstpage
1
Lastpage
8
Abstract
This paper is intended to provide an initial resource for researchers and practitioners entering the isotropic conductive adhesive (ICA) field, but may also prove useful to those with prior experience. It presents an historical overview of the issues confronted in ICA development and use in various electronics packaging application in place of soldering technology
Keywords
conductive adhesives; electronics packaging; interconnections; soldering; electronics packaging applications; isotropic conductive adhesive interconnect technology; ontology; soldering technology; Conductive adhesives; Conductivity; Contacts; Electric resistance; Electronics packaging; Independent component analysis; Lead; Ontologies; Powders; Surface-mount technology;
fLanguage
English
Publisher
ieee
Conference_Titel
High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
Conference_Location
Shanghai
Print_ISBN
0-7803-9292-2
Electronic_ISBN
0-7803-9293-0
Type
conf
DOI
10.1109/HDP.2005.251386
Filename
4017427
Link To Document