Title :
An Ontology for Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications
Author :
Morris, James E. ; Lee, Jeahuck ; Liu, Johan
Author_Institution :
Dept. of Electr. & Comput. Eng., Portland State Univ., OR
Abstract :
This paper is intended to provide an initial resource for researchers and practitioners entering the isotropic conductive adhesive (ICA) field, but may also prove useful to those with prior experience. It presents an historical overview of the issues confronted in ICA development and use in various electronics packaging application in place of soldering technology
Keywords :
conductive adhesives; electronics packaging; interconnections; soldering; electronics packaging applications; isotropic conductive adhesive interconnect technology; ontology; soldering technology; Conductive adhesives; Conductivity; Contacts; Electric resistance; Electronics packaging; Independent component analysis; Lead; Ontologies; Powders; Surface-mount technology;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-9292-2
Electronic_ISBN :
0-7803-9293-0
DOI :
10.1109/HDP.2005.251386
