Title :
Reducing the Electromagnetic Emissions of Smart Power System-on-Chips by Design
Author_Institution :
Eln. Dept., Politec. di Torino, Turin
Abstract :
The paper deals with the electromagnetic emissions of smart power system on chips (SoCs). The architecture of common integrated smart-power systems is described, hence the propagation of core blocks switching noise through the silicon substrate is discussed referring to simple equivalent circuits. Based on that, a new grounding scheme to reduce substrate voltage bounce is presented in detail and its effectiveness to mitigate electromagnetic emission is shown by means of time domain computer simulations.
Keywords :
electromagnetic compatibility; equivalent circuits; power integrated circuits; system-on-chip; time-domain analysis; SoC; core blocks switching noise; electromagnetic emissions; equivalent circuits; smart power system-on-chips; substrate voltage bounce; time domain computer simulations; CMOS technology; Coupling circuits; Grounding; Isolation technology; Power systems; Power transistors; Semiconductor device noise; Silicon; Substrates; Switching circuits;
Conference_Titel :
Electromagnetic Compatibility, 2009 20th International Zurich Symposium on
Conference_Location :
Zurich
Print_ISBN :
978-3-9523286-4-4
DOI :
10.1109/EMCZUR.2009.4783486
