Title :
Wetting Dynamics Study of Sn-Ag Solder during Reflow
Author :
Song, Li ; Bing, An ; Tong-jun, Zhang ; Yi-ping, Wu
Author_Institution :
State Key Lab. of Plastic Forming Simulation & Die & Mould Technol., Huazhong Univ. of Sci. & Technol., Wuhan
Abstract :
At present, solder joints are widely used to bond chips to their substrates for electronic connection and packaging. Good wettability is an essential requirement to form electronic interconnects. In this paper, an image acquisition system was used to observe time-dependent contact angle variation of 96.5Sn-3.5Ag lead-free BGA solder ball on Cu substrate. The wetting dynamics of the solder materials were investigated on Cu substrate, with two flux systems, at different heating temperatures. The results showed that an increase in temperature accelerated the wetting rate of solder significantly. The kind of flux had a large effect on the dynamics of solder wetting. The Suk´s model was discussed to validate the experiment results
Keywords :
contact angle; copper; image processing; interconnections; materials testing; reflow soldering; solders; tin compounds; wetting; Sn-Ag solder; SnAg; Suk´s model; heating temperatures; image acquisition system; lead free BGA solder ball; reflow soldering; time dependent contact angle variation; wetting dynamics; Chip scale packaging; Electronics packaging; Environmentally friendly manufacturing techniques; Goniometers; Heating; Kinetic theory; Lead; Soldering; Surface tension; Temperature;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-9292-2
Electronic_ISBN :
0-7803-9293-0
DOI :
10.1109/HDP.2005.251398
