Title :
An Analytical Model for Thermal Stress Analysis of Multi-layered Microelectronic Packaging
Author :
Wen, Yujun ; Basaran, Cemal
Author_Institution :
Dept. of Civil, Struct. & Environ. Eng., SUNY, Buffalo, NY
Abstract :
Compared to numerical methods, analytical solutions can offer a faster and more accurate procedure for obtaining the interfacial stresses in laminated structures. An analytical model for thermal stress analysis of multi-layered thin stacks on a thick substrate under isothermal loading is proposed in this paper. This analytical approach considers each layer as a beam-type plate with orthotropic material properties. Highly sensitive Moire interferometry is used to validate the model. The strain field in the bi-material interfaces is obtained experimentally. The test data is in good agreement with the proposed analytical solution. Finite element analysis results are also compared with the analytical solution and the test data
Keywords :
failure analysis; function approximation; integrated circuit packaging; light interferometry; stress analysis; thermal stresses; Moire interferometry; analytical model; beam-type plate; bimaterial interfaces; finite element analysis; interfacial delamination; interfacial stresses; isothermal loading; laminated structures; multilayered microelectronic packaging; multilayered thin stacks; orthotropic material properties; thermal stress analysis; Analytical models; Capacitive sensors; Interferometry; Isothermal processes; Material properties; Microelectronics; Packaging; Testing; Thermal loading; Thermal stresses; Interfacial delamination; Interfacial stress; Microelectronic Packaging; Moiré interferometry; Multilayered structure;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-9292-2
Electronic_ISBN :
0-7803-9293-0
DOI :
10.1109/HDP.2005.251400
