DocumentCode :
2734602
Title :
Moisture assist delamination in multiple die stacked package
Author :
Wang, Jun ; Gu, Jin ; Jiang, Lei ; Xiao, Fei ; Shao, Binxian
Author_Institution :
Dept. of Material Sci., Fudan Univ., Shanghai
fYear :
2005
fDate :
27-29 June 2005
Firstpage :
1
Lastpage :
7
Abstract :
The delamination of five-die stacked package with high humidity and high temperature processes was studied by experiments and finite element analysis in the paper. The package were tested by 85degC/85H/196hr condition and followed by solder reflow process. The testing results showed that the delamination was prevalent in samples. Combing the failure analysis of the stack-die package, the finite element analysis was carried out to explain the moisture assist delamination in stacked-die package. The steam pressure in defect void was accounted for in the computations and the energy release rate involving thermal and moisture concentration was discussed as well
Keywords :
delamination; electronics packaging; failure analysis; finite element analysis; reflow soldering; voids (solid); 196 hr; 85 C; energy release rate; failure analysis; finite element analysis; high humidity process; high temperature processes; moisture assist delamination; moisture concentration; solder reflow; stack-die package; steam pressure; thermal concentration; void defect; Delamination; Failure analysis; Finite element methods; Humidity; Lead; Moisture; Packaging machines; Polymer films; Substrates; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-9292-2
Electronic_ISBN :
0-7803-9293-0
Type :
conf
DOI :
10.1109/HDP.2005.251401
Filename :
4017442
Link To Document :
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