• DocumentCode
    2734782
  • Title

    Embedded Passive Technology Application: Design and Fabrication of an Automotive Engine Controller

  • Author

    Zhou, Jiming ; Myers, John D.

  • Author_Institution
    Delphi Electron. & Safety, Kokomo, IN
  • fYear
    2005
  • fDate
    27-29 June 2005
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    This paper summarizes Delphi Electronics and Safety´s activities of design, fabrication, and testing of an automotive engine controller, which was used to demonstrate the feasibility of embedded passives technology. 3M C-Plyreg capacitive and DuPont ceramic resistive materials were used to make embedded capacitors and resistors respectively. The substrate is a 3.25 times 2.75 inch, eight-layer organic laminate board with minimum of 3 mil line/spacing, flip chips, microvias, embedded resistors and capacitors. 205 of 217 resistors of the controller were embedded with a buried rate of 94%. The resistors were designed for laser trimming with every resistor trimmed to a tolerance of plusmn2%. 13 decoupling caps and 12 filter caps were embedded as well. The substrates were assembled and functionally tested. The completed engine controllers were successfully in a vehicle application at speeds over 100 kilometer/h. Design rules, fabrication processes, technology hurdles, and future considerations are also discussed
  • Keywords
    automotive electronics; capacitors; engines; flip-chip devices; resistors; substrates; 2.75 inch; 3.25 inch; Delphi Electronics and Safety; automotive engine controller; capacitive material; ceramic resistive materials; design rules; embedded capacitors; embedded decoupling caps; embedded filter caps; embedded passive technology; embedded resistors; fabrication processes; future considerations; laser trimming; organic laminate board; technology hurdles; Automotive engineering; Capacitors; Ceramics; Electronic equipment testing; Engines; Fabrication; Laminates; Materials testing; Resistors; Safety;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    0-7803-9292-2
  • Electronic_ISBN
    0-7803-9293-0
  • Type

    conf

  • DOI
    10.1109/HDP.2005.251411
  • Filename
    4017452