Title :
Increase stability D-Pak package transistors to thermal loadings
Author :
Kerentsev, A.F. ; Lanin, V.L. ; Anufriev, D.L.
Author_Institution :
Enterprise Plant Transistor
Abstract :
D-Pak package transistors of the raised heat dispersion capacity have a copper alloy crystal mount for maintenance of low thermal resistance. Various technologies of SMT soldering are connected to intensive heating, danger bursting transistor structure, penetration of moisture inside of the package and degradation transistor´s characteristics. Influence constructive and technology factors on stability of transistors to thermal loadings up to 400deg C are investigated
Keywords :
copper; semiconductor device packaging; semiconductor device reliability; soldering; surface mount technology; thermal management (packaging); 400 C; Cu; D-Pak package transistor stability; SMT soldering; copper alloy crystal; thermal loadings; Copper alloys; Moisture; Packaging; Resistance heating; Soldering; Surface-mount technology; Thermal degradation; Thermal loading; Thermal resistance; Thermal stability;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-9292-2
Electronic_ISBN :
0-7803-9293-0
DOI :
10.1109/HDP.2005.251417
