DocumentCode
2734929
Title
A 32nm SRAM design for low power and high stability
Author
Lin, Sheng ; Kim, Yong-Bin ; Lombardi, Fabrizio
Author_Institution
Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA
fYear
2008
fDate
10-13 Aug. 2008
Firstpage
422
Lastpage
425
Abstract
A SRAM cell must meet stringent requirements for operation in the sub-micron/nano ranges. A nine transistor (9T) cell at a 32 nm feature size in CMOS is proposed to accomplish improvements in stability, power dissipation and performance compared with previous designs for low-power memory operation. Initially, this paper presents the optimal transistor sizing for this 9T SRAM cell considering stability, energy consumption, and delay. A write bitline balancing scheme is proposed to reduce the leakage current of the SRAM cell. By optimizing size and employing the proposed write circuitry scheme, a saving of 32% in power dissipation is achieved in memory array operation compared with a conventional 6T SRAM based design. The impact of process variations is investigated in detail, and the HSPICE simulation shows that the 9T SRAM cell has an excellent tolerance to process variations.
Keywords
CMOS integrated circuits; SRAM chips; circuit stability; integrated circuit design; low-power electronics; 9T SRAM cell; CMOS technology; HSPICE simulation; circuit stability; leakage current; memory array operation; power dissipation; size 32 nm; CMOS technology; Circuits; Delay; Design optimization; Energy consumption; Leakage current; Power dissipation; Process design; Random access memory; Stability;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2008. MWSCAS 2008. 51st Midwest Symposium on
Conference_Location
Knoxville, TN
ISSN
1548-3746
Print_ISBN
978-1-4244-2166-4
Electronic_ISBN
1548-3746
Type
conf
DOI
10.1109/MWSCAS.2008.4616826
Filename
4616826
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