• DocumentCode
    2734988
  • Title

    UWB Radio Module Design for Wireless Intelligent Systems-From Specification to Implementation

  • Author

    Shen, Meigen ; Koivisto, Tero ; Peltonen, Teemu ; Zheng, Li-Rong ; Tjukanoff, Esa ; Tenhunen, Hannu

  • Author_Institution
    Lab. of Electron. & Comput. Syst., R. Inst. of Technol., Stockholm
  • fYear
    2005
  • fDate
    27-29 June 2005
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    In this paper, we designed an impulse-based ultra wideband (UWB) radio module (low band) for wireless intelligent system applications such as radio frequency identification (RFID) and wireless sensor networks (WSN). The UWB radio module includes transceiver block, baseband process unit and power management block. The transceiver circuits include Gaussian pulse generator, wideband low noise amplifier (LNA), multiplier, integrator and timing circuits, which use 0.18mum, 1P6M CMOS technology. The wideband LNA has a power gain of 10dB and minimum noise figure of 2.7dB. For UWB transceiver, the power consumption of transmitter is lower than 1mW while the receiver is about 23mW. The liquid-crystal-polymer (LCP)-based system-on-package (SoP) technology is used to implement the UWB radio module for low power, low cost and small size
  • Keywords
    CMOS integrated circuits; integrated circuit design; liquid crystal polymers; low-power electronics; radiofrequency identification; system-in-package; transceivers; wireless sensor networks; 0.18 micron; 10 dB; 1P6M CMOS technology; 2.7 dB; impulse-based radio module; liquid crystal polymer; system-on-package; ultra wideband radio module; wireless intelligent systems; Baseband; CMOS technology; Circuits; Intelligent networks; Intelligent sensors; Intelligent systems; Radiofrequency identification; Transceivers; Ultra wideband technology; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    0-7803-9292-2
  • Electronic_ISBN
    0-7803-9293-0
  • Type

    conf

  • DOI
    10.1109/HDP.2005.251423
  • Filename
    4017464