DocumentCode :
2735068
Title :
Impacts of Pb-free legislation on European HDP
Author :
Conway, Paul P. ; Huang, Zhiheng
Author_Institution :
Wolfson Sch. of Mech. & Manuf. Eng., Loughborough Univ.
fYear :
2005
fDate :
27-29 June 2005
Firstpage :
1
Lastpage :
7
Abstract :
July 2006 shall see the enactment of European legislation to remove lead (Pb) from electronics products. For the majority of the electronics industry there are readily available drop-in solutions in the form of SnAgCu, SnAg, Sn and SnCu based alloys. There are also a number of industries that have opt-outs from the legislation, such as aerospace, defence, medical and automotive sectors. However, there are challenges facing the European based manufacturing industry. The first is the lack of understanding of the effects of reducing scale in solder joints with these new materials systems. As the joint sizes reduce we have to consider how the reducing volumes of materials affects the characteristics of the joints as regards performance and lifetime. Another issue particularly pertinent to the strategic European industries relates to the manufacture and subsequent maintenance of long-life, and in some cases highly regulated, product platforms (e.g. aircraft or medical infrastructure), where the supply of compatible metallization on components may lead to cross-contamination of lead-free and lead-containing solders
Keywords :
copper alloys; electronics industry; government policies; hazardous materials; law; metallisation; silver alloys; soldering; solders; tin alloys; European legislation; Sn-Ag-Cu; compatible metallization material; electronics industry; lead-free legislation; materials systems; solder cross-contamination; solder joints; Aerospace industry; Aerospace materials; Automotive engineering; Electronics industry; Environmentally friendly manufacturing techniques; Joining materials; Lead; Legislation; Manufacturing industries; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-9292-2
Electronic_ISBN :
0-7803-9293-0
Type :
conf
DOI :
10.1109/HDP.2005.251429
Filename :
4017470
Link To Document :
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