Anamorphic Lens MEMS

Author

Cai, Ran ; Xue, Cai ; Cai, Guishun ; Hu, Yu

Author_Institution

Coll. of Phys. Electron., Univ. of Electron. Sci. & Technol. of China, ChengDu

fYear

2005

fDate

27-29 June 2005

Firstpage

1

Lastpage

6

Abstract

Receiver deviates the optimum receiving spatial location, scintillation effect etc. severely impair wireless optical communication, with appropriate size, the novel anamorphic lens MEMS (ALMEMS) suppress the impediments well. The integrated transmitting substratum packaging technologies (ITSP), the integrated receiving substratum package (IRSP) guarantee ALMEMS to run the transmitting aperture lattice technologies (TAL), the receiving adaptable stage with fundamental lattice technologies (RASFL), the receiving zero scaling factor (RZSF), the elastic receiving multi-layers scaling factors (ERMSF) and the receiving aperture lattice factor (RALF) and so forth, well. The transmitting anamorphic lens MEMS (TALM) and the receiving anamorphic lens MEMS (RALM) must cooperate in phase to process the communication well, then the bit-error-rate (BER) is within the normal range in which communication won´t be weakened. To implement the body processing technologies (BP), the steric position packaging technologies (SPP) and so on, the integrating computing system (ICS) serves ALMEMS to get high performances. The strengthened packaging is the firm protection to avoid function failure

Keywords

electronics packaging; microlenses; micromechanical devices; optical communication; anamorphic lens MEMS; body processing technology; integrated receiving substratum; integrated transmitting substratum; steric position packaging; wireless optical communication; Apertures; Bit error rate; Impedance; Lattices; Lenses; Micromechanical devices; Optical fiber communication; Optical receivers; Packaging; Wireless communication; The Anamorphic Lens MEMS (ALMEMS); the Body Processing technologies (BP); the Integrated Receiving Substratum Package (IRSP); the Integrated Transmitting Substratum Packaging technologies (ITSP); the Integrating Computing System (ICS); the Steric Position Packaging technologies (SPP);

fLanguage

English

Publisher

ieee

Conference_Titel

High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on

Conference_Location

Shanghai

Print_ISBN

0-7803-9292-2

Electronic_ISBN

0-7803-9293-0

Type

conf

DOI

10.1109/HDP.2005.251434

Filename

4017475