DocumentCode
2735141
Title
Experiment study influences of some process parameters on dispensing dots consistency in contact dispensing process
Author
Guiling, Deng ; HuiXi, Cui ; QuanFan, Peng ; Jue, Zhong
Author_Institution
Coll. of Mech. & Electr. Eng., Central South Univ., Changsha
fYear
2005
fDate
27-29 June 2005
Firstpage
1
Lastpage
7
Abstract
Good dots consistency including both shape and size is a basic requirement in the process of fluid dispensing dot. Non-Newtonian fluid transferring, which denotes Non-Newtonian fluid transfers from needle tip to the substrate, has important influences on dots consistency in contact dispensing dot. Under dispensing condition the dispenser, needle and fluid material are selected, the main factors affecting Non-Newtonian fluid transferring are as following: the matching condition between dispensing height and parameters affecting fluid extrusion including both fluid volume and extrusion time; the fluctuation of both practical dispensing height and fluid extrusion. Through experiment, this paper studied both the matching relationship between the fluid extrusion and dispensing height and influence of fluctuation of dispensing height on dots consistency in contact dispensing dot process. Experiment results show that decrease the fluctuation of dispensing height by compensating dispensing height error caused by the flatness error of the substrate through software control can improve dots consistency, that dispensing height has direct influence on both dots size and dots consistency and there is a best matching between dispensing height and fluid extrusion volume to accomplishment best dots consistency under specific dispensing condition; and that fluid extrusion time also has some influences on dispensing dots consistency
Keywords
fluctuations; non-Newtonian flow; contact dispensing process; dispensing height error; dots consistency; fluid dispensing dot; fluid extrusion time; nonNewtonian fluid transfers; process parameters; software control; substrate flatness error; Contacts; Educational institutions; Electrical engineering; Error correction; Fluctuations; Microassembly; Needles; Pumps; Shape; Size control;
fLanguage
English
Publisher
ieee
Conference_Titel
High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
Conference_Location
Shanghai
Print_ISBN
0-7803-9292-2
Electronic_ISBN
0-7803-9293-0
Type
conf
DOI
10.1109/HDP.2005.251435
Filename
4017476
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