• DocumentCode
    2735219
  • Title

    Vibration Simulation of Transducer System in Thermosonic Wire bonding

  • Author

    Zhili, Long ; Lei, Han ; Hongquan, Zhou ; Yunxin, Wu ; Jue, Zhong

  • Author_Institution
    Coll. of Electromech. Eng., Central South Univ., Changsha
  • fYear
    2005
  • fDate
    27-29 June 2005
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    The vibration simulation model of transducer system in wire bonding was established by mechanical finite element method and verified by electric sine sweeping exciting method. The results show that, transducer system of wire bonder works with its second combination vibration mode that includes three nodes axial vibration of concentrator and one node radial vibration of capillary. There are many other undesirable modes that may be excited because they are very close to working frequency. These undesirable modes would waste ultrasonic energy and badly influence to bonding quality between gold ball and substrate, so they should be well controlled in bonding. Good agreement between simulation and experimental result was obtained, where the computed error of working frequency is only 1.2%. The research result can be used in performance study and design of an ultrasonic transducer
  • Keywords
    finite element analysis; gold; substrates; tape automated bonding; ultrasonic bonding; ultrasonic transducers; vibrations; Au; electric sine sweeping exciting method; gold ball; mechanical finite element method; one node radial vibration; thermosonic wire bonding; three nodes axial vibration; transducer system; ultrasonic energy; ultrasonic transducer; vibration simulation model; Acoustic transducers; Bonding; Computational modeling; Finite element methods; Frequency; Piezoelectric materials; Piezoelectric transducers; Ultrasonic transducers; Vibrations; Wire; FEM Simulation Model; Thermosonic Wire Bonding; Transducer System; Vibration Characteristics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    0-7803-9292-2
  • Electronic_ISBN
    0-7803-9293-0
  • Type

    conf

  • DOI
    10.1109/HDP.2005.251439
  • Filename
    4017480