• DocumentCode
    2735228
  • Title

    Experimental Studies of Frequency Characteristic on Transducer Power Supply and Vibration System in Ultrasonic Bonding System

  • Author

    Hongquan, Zhou ; Lei, Han ; Jue, Zhong

  • Author_Institution
    Coll. of the Electromech. Eng., Central South Univ., Changsha
  • fYear
    2005
  • fDate
    27-29 June 2005
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    PZT transducer works on its nature frequency in the process of ultrasonic wire bonding. Its actual frequency characteristic needs to be investigated for best performance. A direct digital synthesizer (DDS) was used to sweep frequency for output transformerless (OTL) power amplifier. Actual input and output voltage of OTL power amplifier component was acquired and analyzed. The experiment shows that OTL power amplifier component can be regarded as a linear system and that transfer function for this component also can be obtained with the data processing. This paper studied the influence of the bonding tool also. Deflection vibration of the tool has changed dynamical characteristics of the transducer system
  • Keywords
    direct digital synthesis; integrated circuit bonding; lead bonding; lead compounds; piezoelectric transducers; power amplifiers; power supply circuits; titanium compounds; transfer functions; ultrasonic bonding; ultrasonic transducers; vibrations; zirconium compounds; OTL power amplifier component; PZT transducer; PbZrTiO3; data processing; deflection vibration; direct digital synthesizer; frequency characteristic; linear system; output transformerless power amplifier; transducer power supply; transfer function; ultrasonic bonding system; ultrasonic wire bonding; vibration system; Bonding processes; Frequency; Linear systems; Phase locked loops; Piezoelectric transducers; Power amplifiers; Power supplies; Signal processing; Ultrasonic transducers; Voltage; Bonding tool; Frequency characteristics; OTL power amplifier; Power supply; Ultrasonic bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    0-7803-9292-2
  • Electronic_ISBN
    0-7803-9293-0
  • Type

    conf

  • DOI
    10.1109/HDP.2005.251440
  • Filename
    4017481