Non-Contact Topography Measurements Due to Thermal Deformation in Bonded Structures

Many of opto-electronics devices are fabricated as a bonded structure. Dimensional control is a critical issue in the manufacturing and application of optoelectronics devices. Special attention is required to address and correct possible CTE mismatch between the components of adhesively bonded structures in opto-electronics. Mechanical stress, flexures and warpage can be introduced due to the temperature change. Recently there has been an increasing interest in various experimental analysis technologies. In this study, micro measure measuring system is used to capture whole-field deformation of a bonded structure. Optical method, experimental procedure and results are described in this report