Joint Time-Frequency Analysis of Capillary Tip Vibration in Thermosonic Wire Bonding

Author

Zhili, Long ; Yunxi, Wu ; Lei, Han ; Jue, Zong

Author_Institution

Coll. of Electromech. Eng., Central South Univ., Changsha

fYear

2005

fDate

27-29 June 2005

Firstpage

1

Lastpage

6

Abstract

In thermosonic wire bonding process, the capillary of transducer is a critical component that contacts directly to the ball bump of IC chip, and its vibration characteristic is an important factor that affects directly the bonding quality. The aim of this investigation is to understand the vibration characteristics of capillary tip in thermosonic wire bonding. With laser Doppler non-contact measurement, vibration signal of capillary tip is picked up and analyzed by joint time-frequency analysis. The results show that, compared to pure time or frequency domain analysis, joint time-frequency analysis can more clearly and more completely reveal the dynamic vibration characteristics of capillary tip in joint time-frequency domain, including the shift of frequency, change of harmonic components and its corresponding energy in bonding process. Moreover, joint time-frequency analysis can be used to show success and failure in bonding

Keywords

Doppler measurement; integrated circuit bonding; tape automated bonding; time-frequency analysis; vibrations; IC chip; ball bump; capillary tip vibration; dynamic vibration characteristics; harmonic components; laser Doppler noncontact measurement; thermosonic wire bonding process; time-frequency analysis; time-frequency domain analysis; vibration signal; Bonding processes; Flip chip; Gold; Packaging; Semiconductor device measurement; Signal analysis; Time frequency analysis; Ultrasonic transducers; Vibration measurement; Wire; Capillary Tip; STFT Transform; Thermosonic Wire Bonding; Vibration Characteristic; Wigner-Ville Analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on

Conference_Location

Shanghai

Print_ISBN

0-7803-9292-2

Electronic_ISBN

0-7803-9293-0

Type

conf

DOI

10.1109/HDP.2005.251447

Filename

4017488