Title :
Features of bonded interface and PZT transducer
Author :
Jun-Hui, Li ; Lei, Han ; Jue, Zhong
Author_Institution :
Mech.-Electron. Eng. Coll., Central South Univ., Changsha
Abstract :
A series of experiments was carried out to characteristics at the wedge bond interface. Characteristics of input impedance of PZT transducer were analyzed by the driving electric signal measured by oscilloscope. Bond lift-off characteristics were studied by using SEM with EDS-test. Results show that the pattern of partially bonded material at the interface of ultrasonic wedge bonds exposed by peeling underdeveloped bonds simulates a torus with an unbonded central region. For the same machine variables, input impedance and transforming power of first wedge bond are greater than that of second wedge bond. Some conclusions drawn by analyzing the input impedance and power of PZT consist with results gotten by testing microstructures at interface
Keywords :
lead compounds; scanning electron microscopy; titanium compounds; ultrasonic bonding; ultrasonic transducers; zirconium compounds; EDS; PZT transducer; PbZrTiO3; SEM; bond lift-off characteristics; bonded interface; electric signal; input impedance; machine variables; partially bonded material; ultrasonic wedge bonds; unbonded central region; Aluminum; Bonding; Impedance measurement; Oscilloscopes; Signal analysis; Temperature; Transducers; Ultrasonic variables measurement; Welding; Wire;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-9292-2
Electronic_ISBN :
0-7803-9293-0
DOI :
10.1109/HDP.2005.251449
