DocumentCode
2735410
Title
Study On a Mixed Verification Strategy for IP-Based SoC Design
Author
Wenwei, Chen ; Jinyi, Zhang ; Jiao, Li ; Xiaojun, Ren ; Jiwei, Liu
Author_Institution
Microelectron. R & D Centre, Shanghai Univ.
fYear
2005
fDate
27-29 June 2005
Firstpage
1
Lastpage
4
Abstract
The demands for more powerful products and the huge capacity of today´ s silicon technology move system-on-chip (SoC) designs from the leading-age to mainstream design practice. The one at the very top of the list of challenges to be solved for SoC design is verification. General agreement among many observers is that verification consumes at least 70 percent of whole design percent. SoC verification involves in multi-levels: IP level verification, chip level verification, and hardware/software (HW/SW) co-verification. The last one is the key point to the whole verification process, and some of EDA vendors have provided several EDA tools for HW/SW co-verification. In this paper, the author analyses the architecture of co-verification and the weakness of existing EDA tools, then presents a practical verification strategy based on FPGA, which is more flexible and convenient, and more efficient than traditional verification methods whose hardware and software verification are separate. An experimental result, VAD (video add data) SoC verification, is given as well finally
Keywords
circuit CAD; field programmable gate arrays; formal verification; hardware-software codesign; integrated circuit design; logic design; system-on-chip; EDA tools; FPGA; HW/SW co-verification; IP level verification; IP-based SoC design; VAD SoC verification; chip level verification; hardware/software co-verification; mixed verification strategy; system-on-chip designs; video add data SoC verification; Application specific integrated circuits; Design engineering; Electronic design automation and methodology; Hardware; Microelectronics; Power engineering and energy; Research and development; Silicon; System-on-a-chip; Testing; HW/SW co-verification; IP core; SoC; Verification platfrom;
fLanguage
English
Publisher
ieee
Conference_Titel
High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
Conference_Location
Shanghai
Print_ISBN
0-7803-9292-2
Electronic_ISBN
0-7803-9293-0
Type
conf
DOI
10.1109/HDP.2005.251451
Filename
4017492
Link To Document