DocumentCode
2735483
Title
A new approach to the design, fabrication, and testing of chalcogenide-based multi-state phase-change nonvolatile memory
Author
Ande, H.K. ; Busa, P. ; Balasubramanian, M. ; Campbell, K.A. ; Baker, R.J.
Author_Institution
Dept. of Electr. & Comput. Eng., Boise State Univ., Boise, ID
fYear
2008
fDate
10-13 Aug. 2008
Firstpage
570
Lastpage
573
Abstract
A new approach to developing, fabricating, and testing chalcogenide-based multi-state phase-change nonvolatile memory (NVM) is presented. A test chip is fabricated through the MOSIS service. Then post processing, in the Boise State University lab, is performed on the chip to add the chalcogenide material that forms the NVM. Each memory bit consists of an NMOS access transistor and the chalcogenide material placed between the metal3 of the test chip, connected to the access device, and a common, to all memory bits, electrode. This paper describes the design of the memory bit and of the test structures used for reliability and radiation testing. Fabrication and post-processing of the memory are also discussed.
Keywords
phase change materials; random-access storage; MOSIS service; chalcogenide-based multi-state phase-change nonvolatile memory; memory reliability; test chip; Amorphous materials; Crystalline materials; Crystallization; Fabrication; Nonvolatile memory; Phase change materials; Phase change memory; Space technology; Temperature; Testing; PCM test chip; Phase change memory (PCM); fabrication; memory reliability; nonvolatile memory; post-processing;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2008. MWSCAS 2008. 51st Midwest Symposium on
Conference_Location
Knoxville, TN
ISSN
1548-3746
Print_ISBN
978-1-4244-2166-4
Electronic_ISBN
1548-3746
Type
conf
DOI
10.1109/MWSCAS.2008.4616863
Filename
4616863
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