• DocumentCode
    2735483
  • Title

    A new approach to the design, fabrication, and testing of chalcogenide-based multi-state phase-change nonvolatile memory

  • Author

    Ande, H.K. ; Busa, P. ; Balasubramanian, M. ; Campbell, K.A. ; Baker, R.J.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Boise State Univ., Boise, ID
  • fYear
    2008
  • fDate
    10-13 Aug. 2008
  • Firstpage
    570
  • Lastpage
    573
  • Abstract
    A new approach to developing, fabricating, and testing chalcogenide-based multi-state phase-change nonvolatile memory (NVM) is presented. A test chip is fabricated through the MOSIS service. Then post processing, in the Boise State University lab, is performed on the chip to add the chalcogenide material that forms the NVM. Each memory bit consists of an NMOS access transistor and the chalcogenide material placed between the metal3 of the test chip, connected to the access device, and a common, to all memory bits, electrode. This paper describes the design of the memory bit and of the test structures used for reliability and radiation testing. Fabrication and post-processing of the memory are also discussed.
  • Keywords
    phase change materials; random-access storage; MOSIS service; chalcogenide-based multi-state phase-change nonvolatile memory; memory reliability; test chip; Amorphous materials; Crystalline materials; Crystallization; Fabrication; Nonvolatile memory; Phase change materials; Phase change memory; Space technology; Temperature; Testing; PCM test chip; Phase change memory (PCM); fabrication; memory reliability; nonvolatile memory; post-processing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2008. MWSCAS 2008. 51st Midwest Symposium on
  • Conference_Location
    Knoxville, TN
  • ISSN
    1548-3746
  • Print_ISBN
    978-1-4244-2166-4
  • Electronic_ISBN
    1548-3746
  • Type

    conf

  • DOI
    10.1109/MWSCAS.2008.4616863
  • Filename
    4616863