• DocumentCode
    2735514
  • Title

    A High-Speed Memory Interface Architecture for MPEG2 Video Decoder

  • Author

    Xiaoling, Jia ; Guanghua, Chen ; Weiyu, Zou

  • Author_Institution
    Microelectron. Res. & Design Center, Shanghai Univ.
  • fYear
    2005
  • fDate
    27-29 June 2005
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Motion compensation (MC) routines of MPEG-2 MP@HL video decoding intensively access the video data stored in external memory, thus efficient memory access is critical in the design of decoder chip. In this paper, an advanced architecture of MC is proposed to perform different types of picture prediction modes employed by the MPEG-2 standard and an address translation method is developed for memory interface. In order to relieve the burden of MC, four pixel generators are used to execute bi-prediction and half-pel precision in parallel. Image data fetched from the external frame memory are reused, so that a great amount of frame memory access can be reduced. The features of SDRAM and the fact that all types of MC algorithm have regular memory access patterns are exploited to minimize the number of overhead cycles needed for row activations in array address translation. Compared with the conventional linear translation, array address translation can reduce most of the row activations. The proposed architecture is very effective not only for increasing the speed of memory access but also for improving the performance of MC
  • Keywords
    high-speed integrated circuits; integrated circuit design; memory architecture; motion compensation; random-access storage; video coding; MPEG2 video decoder; SDRAM chips; decoder chip; high-speed memory interface architecture; image data; integrated circuit design; memory access; motion compensation algorithm; Clocks; Decoding; Frequency; Image coding; Image storage; Memory architecture; Microelectronics; Registers; SDRAM; Video compression; SDRAM; memory interface; motion compensation; video decoder;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    0-7803-9292-2
  • Electronic_ISBN
    0-7803-9293-0
  • Type

    conf

  • DOI
    10.1109/HDP.2005.251457
  • Filename
    4017498