Manufacturing implications of ultrahigh speed packaging and interconnect design

Author

Beckenbaugh, William M.

Author_Institution

Motorola Commun. Sector, Schaumburg, IL, USA

fYear

1988

fDate

13-15 Jun 1988

Firstpage

108

Lastpage

111

Abstract

Ultra-high-speed and high-lead-count IC packaging places stringent requirements on the assembly materials and processes, interconnection technology, and physical design of products. The factory automation, testing, and information transfer requirements are also significantly increased. The impact of these requirements on interconnect media fabrication tolerances and assembly methods is discussed

Keywords

assembling; factory automation; integrated circuit manufacture; integrated circuit technology; integrated circuit testing; packaging; assembly; fabrication tolerances; factory automation; high-lead-count IC packaging; information transfer; interconnect design; interconnection technology; testing; ultrahigh speed packaging; Capacitive sensors; Ceramics; Conducting materials; Integrated circuit interconnections; Lead; Manufacturing; Nonhomogeneous media; Packaging; Polymers; Thermal expansion;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International

Conference_Location

Neuilly sur Seine

Type

conf

DOI

10.1109/EEMTS.1988.75967

Filename

75967

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2735561