Title :
Manufacturing implications of ultrahigh speed packaging and interconnect design
Author :
Beckenbaugh, William M.
Author_Institution :
Motorola Commun. Sector, Schaumburg, IL, USA
Abstract :
Ultra-high-speed and high-lead-count IC packaging places stringent requirements on the assembly materials and processes, interconnection technology, and physical design of products. The factory automation, testing, and information transfer requirements are also significantly increased. The impact of these requirements on interconnect media fabrication tolerances and assembly methods is discussed
Keywords :
assembling; factory automation; integrated circuit manufacture; integrated circuit technology; integrated circuit testing; packaging; assembly; fabrication tolerances; factory automation; high-lead-count IC packaging; information transfer; interconnect design; interconnection technology; testing; ultrahigh speed packaging; Capacitive sensors; Ceramics; Conducting materials; Integrated circuit interconnections; Lead; Manufacturing; Nonhomogeneous media; Packaging; Polymers; Thermal expansion;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International
Conference_Location :
Neuilly sur Seine
DOI :
10.1109/EEMTS.1988.75967
