DocumentCode :
2736088
Title :
SOI MOSFET as potential replacement of mechanical relays in electrical systems
Author :
Fardoun, Abbas A. ; Hassan, Mona ; Mohammed, Heba ; Jomaah, Jalal
Author_Institution :
Electr. Eng. Dept., UAE Univ., Al Ain
fYear :
2008
fDate :
10-13 Aug. 2008
Firstpage :
718
Lastpage :
721
Abstract :
This work is dedicated to design a power SOI (silicon-on-insulator) MOSFET switch to replace the Mechanical power relays used in Electrical systems. Mechanical relays are relatively large in size, expensive & have slow response time. Presented simulations & measurements show that two bulk MOSFETs in series can replace a mechanical relay in an AC drive, however, losses increase due to the series connection. Indeed, SOI power switch becomes to have better characteristics over the mechanical or Bulk MOSFET power switches in terms of higher breakdown voltage, lower specific on-resistance, low leakage current and the controllability of heat impact. Many SOI technologies are adopted for power and automation applications and the most intriguing power SOI is found to be the RF LDMOSFET. Two dimension Numerical Simulations has been achieved using Medici tool. RF LDMOSFET exhibits high breakdown voltage of 70 V and low specific on-state resistance of 0.19 mOmega cm2.
Keywords :
power MOSFET; relays; semiconductor device breakdown; silicon-on-insulator; AC drive; Medici tool; RF LDMOSFET; breakdown voltage; electrical systems; low leakage current and; lower specific on-resistance; mechanical power relays; numerical simulations; power SOI MOSFET switch; power switch; silicon-on-insulator; voltage 70 V; Delay; Loss measurement; MOSFET circuits; Mechanical variables measurement; Power MOSFET; Power system relaying; Radio frequency; Relays; Silicon on insulator technology; Switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 2008. MWSCAS 2008. 51st Midwest Symposium on
Conference_Location :
Knoxville, TN
ISSN :
1548-3746
Print_ISBN :
978-1-4244-2166-4
Electronic_ISBN :
1548-3746
Type :
conf
DOI :
10.1109/MWSCAS.2008.4616900
Filename :
4616900
Link To Document :
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