DocumentCode :
2737195
Title :
Extraction of Lumped Element Parameters of Bonding Pad and Internal Arrangement for Ladder-type SAW Filters Using Neural Network Techniques
Author :
Wang, Shuming T. ; Xie, Zhi-Feng ; Liu, Tzu-Te ; Hwang, Rey-Chue
Author_Institution :
I-Shou Univ., Kaohsiung
fYear :
2007
fDate :
5-7 Sept. 2007
Firstpage :
270
Lastpage :
270
Abstract :
Ladder-type surface acoustic wave (SAW) filter is commonly used RF filter in many communication systems. The circuit structure of a ladder-type filter consists of several one-port SAW resonators on a piezo-electric substrate arranged in series and parallel alternatively. The bonding pads of the one-port SAW resonators and the internal connections may present a significant influence on the performance of the filter Hence, how to incorporate the bonding pad and internal arrangement effects into early stage of the filter design is an important issue. In this paper, neural network was employed to extract the lumped element parameters of bonding pads and internal connections. As an example, an RF ladder-type SAW filter used in GPS system was examined. The result showed a good agreement with that obtained from full wave EM simulator.
Keywords :
Global Positioning System; lumped parameter networks; network synthesis; neural nets; radiofrequency filters; surface acoustic wave resonator filters; GPS system; RF filter; SAW filters; SAW resonators; bonding pad; filter design; full wave EM simulator; ladder-type filter; lumped element parameters; neural network techniques; piezoelectric substrate; surface acoustic wave filter; Bonding; Circuit simulation; Global Positioning System; Neural networks; Packaging; RLC circuits; Radio frequency; Resonator filters; SAW filters; Surface acoustic waves;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Innovative Computing, Information and Control, 2007. ICICIC '07. Second International Conference on
Conference_Location :
Kumamoto
Print_ISBN :
0-7695-2882-1
Type :
conf
DOI :
10.1109/ICICIC.2007.300
Filename :
4427915
Link To Document :
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