DocumentCode :
2737957
Title :
Software for multi-port RF network analysis with a large number of frequency samples and application to 5-port SAW device measurement
Author :
Hartmann, C.S. ; Hartmann, R.T.
Author_Institution :
Hartmann Res., Inc., Dallas, TX, USA
fYear :
1990
fDate :
4-7 Dec 1990
Firstpage :
117
Abstract :
A large project for experimentally measuring the properties of several-hundred SAW (surface acoustic wave) SPUDTs (single-phase unidirectional transducers) is discussed. To determine the desired SAW SPUDT properties, it was necessary to measure all elements of the five-port Y-matrix of each test device at a minimum of 8192 frequencies. The measurement was performed using a microwave wafer probe system in conjunction with a two-port network analyzer. Two different software packages are described. The first, the measurement software, allows the measurement of a large number of frequency samples with an HP8753 network analyzer. The second package, the data manipulation software, is more specialized in that it is only applicable to measured S-parameters from a special five-transducer test structure. Its computed results provide the equivalent of making direct experimental measurements at the two acoustic ports of the center transducer
Keywords :
S-parameters; circuit analysis computing; computerised instrumentation; microwave measurement; multiport networks; network analysers; piezoelectric transducers; surface acoustic wave devices; ultrasonic transducers; 5-port SAW device; HP8753 network analyzer; S-parameters; SAW SPUDT; data manipulation software; five-port Y-matrix; five-transducer test structure; measurement software; microwave wafer probe system; multi-port RF network analysis; single-phase unidirectional transducers; software packages; two-port network analyzer; Acoustic measurements; Acoustic testing; Acoustic transducers; Acoustic waves; Frequency measurement; Radio frequency; Software measurement; Software packages; Surface acoustic wave devices; Surface acoustic waves;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 1990. Proceedings., IEEE 1990
Conference_Location :
Honolulu, HI
Type :
conf
DOI :
10.1109/ULTSYM.1990.171337
Filename :
171337
Link To Document :
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