DocumentCode
2738562
Title
[Breaker page]
fYear
2008
fDate
22-24 Oct. 2008
Firstpage
2
Lastpage
2
Abstract
Breaker page.
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location
Taipei
Print_ISBN
978-1-4244-3623-1
Type
conf
DOI
10.1109/IMPACT.2008.4783793
Filename
4783793
Link To Document