• DocumentCode
    2738637
  • Title

    Analog and mixed-signal benchmark circuits-first release

  • Author

    Kaminska, B. ; Arabi, K. ; Bell, I. ; Goteti, P. ; Huertas, J.L. ; Kim, B. ; Rueda, A. ; Soma, M.

  • Author_Institution
    Opmaxx Inc., USA
  • fYear
    1997
  • fDate
    1-6 Nov 1997
  • Firstpage
    183
  • Lastpage
    190
  • Abstract
    The IEEE Mixed-Signal Technical Activity Committee is developing a common set of benchmark circuits for use in researching and evaluating analog fault modeling, test generation, design-for-test, and built-in self-test methodologies. The first release circuits are based on MITEL Semiconductor´s 1.5 μm and 1.2 μm CMOS technologies and they will allow engineers and researchers working in analog and mixed-signal testing to compare test results as is done in the digital domain. This paper presents a set of typical circuits described by netlists in HSPICE format. Schematic diagrams, simulation results and measured results, if available, are provided together with layout and a typical test environment. The full details are available on the web page dedicated to analog and mixed-signal benchmarks
  • Keywords
    CMOS analogue integrated circuits; SPICE; application specific integrated circuits; automatic test equipment; band-pass filters; digital-analogue conversion; mixed analogue-digital integrated circuits; performance evaluation; phase locked loops; switched capacitor filters; 1.2 mum; 1.5 mum; CMOS technologies; HSPICE format; IEEE Mixed-Signal Technical Activity Committee; MITEL Semiconductor; PLL; analog benchmarks; analog fault modeling; bandpass SC filter; built-in self-test; design-for-test; ladder DAC; mixed-signal benchmark circuits; netlists; simulation; test generation; Automatic testing; Benchmark testing; Built-in self-test; CMOS technology; Circuit faults; Circuit testing; Design for testability; Semiconductor device modeling; Semiconductor device testing; Technical activities;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1997. Proceedings., International
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-4209-7
  • Type

    conf

  • DOI
    10.1109/TEST.1997.639612
  • Filename
    639612