Title :
Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds Developed by Diffusion Couples
Author :
Yang, Ping-Feng ; Jian, Sheng-Rui ; Lai, Yi-Shao ; Chen, Rong-Sheng
Author_Institution :
Central Labs., Adv. Semicond. Eng., Inc., Kaohsiung
Abstract :
Nanotribological characteristics, including coefficient of friction, wear coefficient, and wear resistance, of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds developed by annealing Sn-Cu or Sn-Ni diffusion couples were investigated in this work. The scratch test conditions combine a constant normal load of 10, 20, or 30 mN and a scratch rate of 0.1 1, or 10 mum/s. Experimental results indicate that as the normal load increases, the pile-up heightens and the scratch deepens, leading to greater coefficient of friction and wear coefficient while smaller wear resistance. Moreover, the scratch rate does not have a significant effect on the nanotribological characteristics except for Cu6Sn5 and Cu3Sn under a normal load of 10 mN. Though hardness of Cu6Sn5, Cu3Sn, and Ni3Sn4 is similar, Ni3Sn4 appears to be more prone to wear damage.
Keywords :
annealing; copper alloys; diffusion; electronics packaging; friction; hardness; nanomechanics; nickel alloys; solders; tin alloys; wear resistance; Cu3Sn; Cu6Sn5; Ni3Sn4; annealing; diffusion; electronic packaging; friction; hardness; intermetallic compounds; nanotribological characteristics; scratch test; solder joints; wear coefficient; wear resistance; Annealing; Dispersion; Friction; Intermetallic; Lead; Materials science and technology; Semiconductor thin films; Soldering; Testing; Tin;
Conference_Titel :
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3623-1
Electronic_ISBN :
978-1-4244-3624-8
DOI :
10.1109/IMPACT.2008.4783809