• DocumentCode
    2738866
  • Title

    The Optimal window-BGA Design for High-Speed SDRAM

  • Author

    Huang, Chih-Yi ; Cheng, Hung-Hsiang ; Wang, Chen-Chao ; Huang, Ya-Wen ; Tsun-Lung Hsieh

  • Author_Institution
    Electr. Lab., Adv. Semicond. Eng., Inc., Kaohsiung
  • fYear
    2008
  • fDate
    22-24 Oct. 2008
  • Firstpage
    71
  • Lastpage
    74
  • Abstract
    The high performance window-BGA for a high speed Synchronous Dynamic Random Access Memory (SDRAM) has been designed. In this paper, power distribution system (PDS) design on IC package is discussed and studied. A appropriate PDS design will provide not only the stable power supply but also the superior current return path for signal channels. The simulation approach will cover complete Signal Integrity (SI) and Power Integrity (PI) analysis to quantify the electrical performance. The parasitical parameters of IC package including resistance, inductance and capacitance are extracted to check low frequency performance, and S-parameters are performed to observe the broad bandwidth response to ensure sufficient low transmission loss through entire operation frequency range. The PDS behavior in both frequency and time domain are characterized to make sure the PDS performance. Finally, eye diagram are analyzed to inspect overall electrical performance.
  • Keywords
    DRAM chips; S-parameters; ball grid arrays; integrated circuit packaging; power distribution; BGA; IC package; S-parameters; bandwidth response; capacitance; eye diagram; high speed synchronous dynamic random access memory; high-speed SDRAM; inductance; operation frequency; power distribution system; power integrity analysis; resistance; signal integrity analysis; transmission loss; Analytical models; Electric resistance; Frequency; Integrated circuit packaging; Performance analysis; Power distribution; Power supplies; SDRAM; Signal analysis; Signal design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3623-1
  • Electronic_ISBN
    978-1-4244-3624-8
  • Type

    conf

  • DOI
    10.1109/IMPACT.2008.4783810
  • Filename
    4783810