Investigate the Performance of SnCuNi (SCN) Alloy for Wave Soldering

Author

Li, K.C. ; Huang, Jay C Y ; Ku, J.L. ; Lee, Synger

Author_Institution

Process Technol. Enabling & Mater. Characterization Div., Wistron Corp., Hsinchu

fYear

2008

fDate

22-24 Oct. 2008

Firstpage

114

Lastpage

117

Abstract

The solderability of SnAgCu (SAC305) and SnCuNi (SCN) alloys for DIP components on thick PCB (2.3 mm) with OSP and LF-HASL surface finishes were studied. Force rework was also applied after DIP process by using SCN and SAC305 solder alloys. In addition, the SCN solder properties, including copper dissolution, mixed alloys, solder joint corrosion, and corrosion property to soldering tank were tested.

Keywords

austenitic stainless steel; copper alloys; corrosion resistance; dissolving; nickel alloys; printed circuits; reliability; silver alloys; solders; surface finishing; thermal stress cracking; tin alloys; wave soldering; (CuNi)₆Sn₅; DIMM socket; DIP components; LF-HASL surface finishing; OSP surface finishing; PCB; SAC305 solder alloys; SCN solder alloys; SS316L alloy; SnAgCu-FeCrCJk; SnCuNi-FeCrCJk; TiJk; copper dissolution; electrolyte capacitor; headers; reliability; solder joint corrosion resistance; soldering tank; temperature 0 C to 100 C; temperature 270 C; temperature 300 C; thermal shock tests; time 28 min; time 650 hr; wave soldering; Circuit testing; Copper alloys; Corrosion; Electric shock; Electronics packaging; Environmentally friendly manufacturing techniques; Germanium alloys; Lead; Performance evaluation; Soldering; SnCuNi alloy; copper dissolution; solderability; wave soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International

Conference_Location

Taipei

Print_ISBN

978-1-4244-3623-1

Electronic_ISBN

978-1-4244-3624-8

Type

conf

DOI

10.1109/IMPACT.2008.4783821

Filename

4783821