Title :
Investigate the Performance of SnCuNi (SCN) Alloy for Wave Soldering
Author :
Li, K.C. ; Huang, Jay C Y ; Ku, J.L. ; Lee, Synger
Author_Institution :
Process Technol. Enabling & Mater. Characterization Div., Wistron Corp., Hsinchu
Abstract :
The solderability of SnAgCu (SAC305) and SnCuNi (SCN) alloys for DIP components on thick PCB (2.3 mm) with OSP and LF-HASL surface finishes were studied. Force rework was also applied after DIP process by using SCN and SAC305 solder alloys. In addition, the SCN solder properties, including copper dissolution, mixed alloys, solder joint corrosion, and corrosion property to soldering tank were tested.
Keywords :
austenitic stainless steel; copper alloys; corrosion resistance; dissolving; nickel alloys; printed circuits; reliability; silver alloys; solders; surface finishing; thermal stress cracking; tin alloys; wave soldering; (CuNi)6Sn5; DIMM socket; DIP components; LF-HASL surface finishing; OSP surface finishing; PCB; SAC305 solder alloys; SCN solder alloys; SS316L alloy; SnAgCu-FeCrCJk; SnCuNi-FeCrCJk; TiJk; copper dissolution; electrolyte capacitor; headers; reliability; solder joint corrosion resistance; soldering tank; temperature 0 C to 100 C; temperature 270 C; temperature 300 C; thermal shock tests; time 28 min; time 650 hr; wave soldering; Circuit testing; Copper alloys; Corrosion; Electric shock; Electronics packaging; Environmentally friendly manufacturing techniques; Germanium alloys; Lead; Performance evaluation; Soldering; SnCuNi alloy; copper dissolution; solderability; wave soldering;
Conference_Titel :
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3623-1
Electronic_ISBN :
978-1-4244-3624-8
DOI :
10.1109/IMPACT.2008.4783821
