DocumentCode
2739117
Title
Reworking Lead-Free Array Packages on Double Sided Printed Circuit Boards
Author
Wood, Paul
Author_Institution
Market Dev., OK Int., Garden Grove, CA
fYear
2008
fDate
22-24 Oct. 2008
Firstpage
118
Lastpage
120
Abstract
Whether using lead-bearing or lead-free processes, and whether reworking conventional or array package components, the principal steps in rework, (desoldering, removal, site cleaning and reattachment) remain largely the same. This article proposes to focus on heating, the biggest issue introduced by lead-free rework, and how best to reflow array package components on large double-sided printed circuit boards (PCBs).
Keywords
ball grid arrays; heating; printed circuit manufacture; printed circuits; reflow soldering; BGA; PCB; array package components; desoldering; double sided printed circuit board; heating; reattachment process; reflow; removal process; reworking; site cleaning; Bridge circuits; Circuit faults; Environmentally friendly manufacturing techniques; Lead; Packaging; Pressure control; Printed circuits; Size control; Temperature control; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location
Taipei
Print_ISBN
978-1-4244-3623-1
Electronic_ISBN
978-1-4244-3624-8
Type
conf
DOI
10.1109/IMPACT.2008.4783822
Filename
4783822
Link To Document