Fatigue Life Evaluation of Ball Grid Array Packages with Sn-Ag-Cu and Rare-Earth Addition Solder under Cyclic Bending Test

Author

Cheng, Chih-Yuan ; Zhan, Chau-Jie ; Tung-Han, Chuang

Author_Institution

Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst. (ITRI), Hsinchu

fYear

2008

fDate

22-24 Oct. 2008

Firstpage

121

Lastpage

124

Abstract

The reliability of BGA assembly packages were evaluated by rapid fatigue life test. Three-point bend fatigue life test method has been developed for Sn-Ag-Cu 305 and rare-earth addition Sn-Ag-Cu-Ce solder joints. In this study, BGA assembly with Ni/Au surface finish was tested under cyclic bending load at room temperature. The bending fatigue life of Sn-Ag-Cu 305 solder joint was compared with rare-earth addition Sn-Ag-Cu-Ce solder joint. Experimental results showed that the failure mode of cyclic bending test was similar to thermal cycling test, and the rare-earth addition solder joint has lower bending fatigue life than Sn-Ag-Cu 305. Failure mode analysis showed that the crack failure was due to solder joint fatigue and was only propagating through the joint, but not through intermetallic compound (IMC). This study also established a real-time monitoring reliability test method. It can easily find the location of failure solder joint and precisely predict solder joint bending fatigue life.

Keywords

cerium alloys; copper alloys; cracks; failure (mechanical); fatigue testing; gold; nickel; reliability; silver alloys; solders; tin alloys; Ni-Au; SnAgCu; SnAgCuCe; ball grid array packages; cyclic bending test; fatigue life evaluation; rapid fatigue life test; rare-earth addition solder; real-time monitoring reliability test method; reliability; room temperature; temperature 293 K to 298 K; three-point bend fatigue life test method; Assembly; Electronics packaging; Failure analysis; Fatigue; Gold; Intermetallic; Life testing; Soldering; Surface finishing; Temperature; Dynamic fatigue test; Rare-Earth addition solder; Reliability evaluation; Thermal cycling test;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International

Conference_Location

Taipei

Print_ISBN

978-1-4244-3623-1

Electronic_ISBN

978-1-4244-3624-8

Type

conf

DOI

10.1109/IMPACT.2008.4783823

Filename

4783823