Title :
Intrinsic modification and interfacial behavior in a titanium-copper metal matrix composite
Author :
Fouad, Yasser ; Rabeeh, Bakr M.
Author_Institution :
Engineering and Materials Science Dept. German University in Cairo, GUC
Abstract :
The application of hot uniaxial pressing has been carried out in the temperature range of 750-950 °C for 0.5, 1 and 2 h at uniaxial pressure of 3 MPa in vacuum. Ti/Cu-Zn/Ti foil-foil layup are hot pressed for a lamellar composite structure symmetrically arranged. Inter diffusion bonding between commercially pure titanium and Copper-Zinc (brass) is applied. The microstructure of the diffusion zone has been analyzed by optical and scanning electron microscopy (SEM). The inter diffusion of the diffusing species across the interface has been evaluated by energy dispersive X-ray spectroscopy EDX. The reaction products formed at the interface have been identified by X-ray diffraction technique. It has been observed that the diffusion zone is dominated by the presence of the low melting depressant (LMD) Zn that segregate into Ti side and the solid solution of β-Ti (solutes are Zn, Cu and Ni) close to the titanium. The presence of Cu and Zn and Ti has been found in the interphase reaction zone. It has been observed that the interfacial bond strength (~200 MPa) is highest for the couple processed at 800 °C and this value decreases with rise in joining temperature. The variation of strength of the transition joints is co-related with the microstructural characteristics of the diffusion zone. The application of brass (Cu-Zn) interlayer bonding of pure titanium introduced with different micro constituents. The control of interphase is dominant for composite processing.
Keywords :
X-ray chemical analysis; X-ray diffraction; brass; chemical interdiffusion; crystal microstructure; hot pressing; melting; optical microscopy; particle reinforced composites; scanning electron microscopy; segregation; solid solutions; titanium; EDX; SEM; Ti-CuZn-Ti; X-ray diffraction; brass interlayer bonding; copper-zinc sample; diffusion zone; energy dispersive X-ray spectroscopy; hot uniaxial pressing; interdiffusion bonding; interfacial bond strength; interfacial property; interphase reaction zone; lamellar composite structure; low melting depressant; microstructural property; microstructure; optical microscopy; pressure 3 MPa; scanning electron microscopy; segregation; solid solution; temperature 750 degC to 950 degC; time 0.5 h; time 1 h; time 2 h; titanium-copper metal matrix composite; Bonding; Delamination; Materials; Scanning electron microscopy; Titanium; Zinc; Diffusion joint; Inter-diffusion; Micro mechanical Modeling; Ti-Cu;
Conference_Titel :
Engineering and Technology (ICET), 2012 International Conference on
Conference_Location :
Cairo
Print_ISBN :
978-1-4673-4808-9
DOI :
10.1109/ICEngTechnol.2012.6396146