• DocumentCode
    2739237
  • Title

    Measurements and Simulation of the Dynamic Characteristics of Micro-Machined Torsion Mirrors

  • Author

    Gau, Wei-Hsin ; Chen, Kun-Nan ; Chang, Tao-Ching

  • Author_Institution
    Dept. of Mechatron. Eng., Huafan Univ., Taipei
  • fYear
    2008
  • fDate
    22-24 Oct. 2008
  • Firstpage
    145
  • Lastpage
    148
  • Abstract
    A cross-shaped torsion mirror, fabricated by a micro-machining process, was analyzed by finite element analysis with ANSYS and COMSOL software packages. The micro-structure´s resonance frequencies and mode shapes were also measured by using the Electronic Speckle Pattern Interferometry and Stroboscopic Interferometry techniques, which both are full-field and non-contact experimental procedures. Four sets of modal data, two from FE analysis and two from experiments, were compared and shown having a significant discrepancy in their frequency values, although their mode shapes were quite consistent. Inconsistency in the frequency results due to erroneous inputs that included geometrical and material parameters to the FE analysis could be salvaged by applying the finite element model updating procedure. When administrating the updating technique, the number of updating parameters should be kept small and only the uncertain ones should be selected as the updating parameters. Such a parameter that was mostly doubtful as the depth dimension of a micro-structure should definitely be included in the optimization process. Two updating cases showed that the optimization sequence converged rather quickly for both cases and significant improvements in frequency prediction were achieved. With the inclusion of the thickness parameter, the second case yielded frequency differences under 5% in all three modes, and its all three updating parameters attained final updated values that were much more reliable.
  • Keywords
    electronic speckle pattern interferometry; finite element analysis; micro-optomechanical devices; micromirrors; optimisation; ANSYS; COMSOL; cross-shaped torsion mirror; dynamic characteristics; electronic speckle pattern interferometry; finite element analysis; micro-structure; micromachining; mode shapes; optimization; resonance frequencies; software packages; stroboscopic interferometry; Finite element methods; Frequency measurement; Interferometry; Mirrors; Resonance; Resonant frequency; Shape measurement; Software packages; Solid modeling; Speckle;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3623-1
  • Electronic_ISBN
    978-1-4244-3624-8
  • Type

    conf

  • DOI
    10.1109/IMPACT.2008.4783828
  • Filename
    4783828