DocumentCode
2739237
Title
Measurements and Simulation of the Dynamic Characteristics of Micro-Machined Torsion Mirrors
Author
Gau, Wei-Hsin ; Chen, Kun-Nan ; Chang, Tao-Ching
Author_Institution
Dept. of Mechatron. Eng., Huafan Univ., Taipei
fYear
2008
fDate
22-24 Oct. 2008
Firstpage
145
Lastpage
148
Abstract
A cross-shaped torsion mirror, fabricated by a micro-machining process, was analyzed by finite element analysis with ANSYS and COMSOL software packages. The micro-structure´s resonance frequencies and mode shapes were also measured by using the Electronic Speckle Pattern Interferometry and Stroboscopic Interferometry techniques, which both are full-field and non-contact experimental procedures. Four sets of modal data, two from FE analysis and two from experiments, were compared and shown having a significant discrepancy in their frequency values, although their mode shapes were quite consistent. Inconsistency in the frequency results due to erroneous inputs that included geometrical and material parameters to the FE analysis could be salvaged by applying the finite element model updating procedure. When administrating the updating technique, the number of updating parameters should be kept small and only the uncertain ones should be selected as the updating parameters. Such a parameter that was mostly doubtful as the depth dimension of a micro-structure should definitely be included in the optimization process. Two updating cases showed that the optimization sequence converged rather quickly for both cases and significant improvements in frequency prediction were achieved. With the inclusion of the thickness parameter, the second case yielded frequency differences under 5% in all three modes, and its all three updating parameters attained final updated values that were much more reliable.
Keywords
electronic speckle pattern interferometry; finite element analysis; micro-optomechanical devices; micromirrors; optimisation; ANSYS; COMSOL; cross-shaped torsion mirror; dynamic characteristics; electronic speckle pattern interferometry; finite element analysis; micro-structure; micromachining; mode shapes; optimization; resonance frequencies; software packages; stroboscopic interferometry; Finite element methods; Frequency measurement; Interferometry; Mirrors; Resonance; Resonant frequency; Shape measurement; Software packages; Solid modeling; Speckle;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location
Taipei
Print_ISBN
978-1-4244-3623-1
Electronic_ISBN
978-1-4244-3624-8
Type
conf
DOI
10.1109/IMPACT.2008.4783828
Filename
4783828
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