Title :
Substrate Approach for the Symphony Of IC & Packaging
Abstract :
In this paper, there will be detail discussed to let reader understand the trend of IC & substrate & packaging technology and how to react with each others such as symphony.
Keywords :
integrated circuit packaging; IC; integrated circuit technology; packaging technology; substrate approach; symphony; Bonding; Consumer electronics; Electronics packaging; Flip chip; Integrated circuit packaging; Manufacturing; Product design; Space technology; Through-silicon vias; Wire;
Conference_Titel :
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3623-1
Electronic_ISBN :
978-1-4244-3624-8
DOI :
10.1109/IMPACT.2008.4783831
