Title :
New Challenge and new Material for high density Wire Bond and Flip Chip CSP Substrate
Author :
Shang, James ; Liu, Kung-Hua ; Lin, Steven
Abstract :
New types of packaging technology which include the wire bond and flip chip for chip scale package, demand a high wiring density, high I/O density and a high performance, which in turn, narrows the pitch of the substrate so as to achieve the smallest possible package in order to keep up with the trend of the demand for smaller, lighter, and thinner compacted consumer products. This paper discusses the new challenges brought by these new trends for substrate makers and assemblers as well as material suppliers.
Keywords :
chip scale packaging; flip-chip devices; integrated circuit bonding; integrated circuit interconnections; integrated circuit manufacture; semiconductor device manufacture; semiconductor device packaging; semiconductor industry; substrates; chip scale package; flip chip CSP substrate; high density wire bond material; interconnecting technology; packaging technology; semiconductor manufacturing; substrate pitch; Assembly; Bonding; Chip scale packaging; Etching; Fingers; Flip chip; Integrated circuit interconnections; Space technology; Substrates; Wire;
Conference_Titel :
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3623-1
Electronic_ISBN :
978-1-4244-3624-8
DOI :
10.1109/IMPACT.2008.4783832
