Title :
Fine Line/Space Technology for Flip Chip Substrate
Author_Institution :
NAN YA PRINTED CIRCUIT BOARD CORP. (NYPCB)
Abstract :
As the market pursues thinner, lighter and smaller design on electronic products with better performance of high speed processing and multi-function etc, FLS (Fine Line Space) technology will play a key role of the new design for advanced substrate development. The upcoming FLS design as 10/10 um and getting finer which create many technical/ process/ equipment/ measurement & reliability bottlenecks.
Keywords :
electronic products; flip-chip devices; advanced substrate development; electronic products; fine line space technology; flip chip substrate; Dielectrics; Etching; Flip chip; Rough surfaces; Space technology; Stress; Substrates; Surface emitting lasers; Surface finishing; Surface roughness;
Conference_Titel :
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3623-1
Electronic_ISBN :
978-1-4244-3624-8
DOI :
10.1109/IMPACT.2008.4783833
