DocumentCode
2739373
Title
Fine Line/Space Technology for Flip Chip Substrate
Author
Lin, Max
Author_Institution
NAN YA PRINTED CIRCUIT BOARD CORP. (NYPCB)
fYear
2008
fDate
22-24 Oct. 2008
Firstpage
162
Lastpage
163
Abstract
As the market pursues thinner, lighter and smaller design on electronic products with better performance of high speed processing and multi-function etc, FLS (Fine Line Space) technology will play a key role of the new design for advanced substrate development. The upcoming FLS design as 10/10 um and getting finer which create many technical/ process/ equipment/ measurement & reliability bottlenecks.
Keywords
electronic products; flip-chip devices; advanced substrate development; electronic products; fine line space technology; flip chip substrate; Dielectrics; Etching; Flip chip; Rough surfaces; Space technology; Stress; Substrates; Surface emitting lasers; Surface finishing; Surface roughness;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location
Taipei
Print_ISBN
978-1-4244-3623-1
Electronic_ISBN
978-1-4244-3624-8
Type
conf
DOI
10.1109/IMPACT.2008.4783833
Filename
4783833
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