Title :
Advanced Screen Printing "Practical Approaches for Printable & Flexible Electronics"
Author :
Numakura, Dominique
Author_Institution :
DKN Res., Haverhill, MA
Abstract :
Screen-printing is not a new technology in the printed circuit industry. However, the combinations of new paste materials and an advanced screen-printing process further increases the value of printable flexible electronics that cannot be made by the traditional photolithography process with copper foils. Additionally, more functionality from the circuits will be generated with new materials in the future. The paper shows an example of electronic sensor module made by multiple screen-printing processes with different ink pastes. All passive components of the circuit were formed by the screen-printing process. The new silver paste makes soldering possible directly with the conductor; therefore the active components are assembled by a standard soldering process that is not available for the traditional polymer thick film circuits.
Keywords :
electronics packaging; flexible electronics; thick film devices; active components; electronic sensor module; flexible electronics; paste materials; printable electronics; printed circuit industry; screen printing; soldering; Conducting materials; Conductive films; Copper; Flexible electronics; Flexible printed circuits; Ink; Lithography; Printing; Silver; Soldering;
Conference_Titel :
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3623-1
Electronic_ISBN :
978-1-4244-3624-8
DOI :
10.1109/IMPACT.2008.4783845