Title :
The composition of intermetallic compounds in Sn-Ag-Bi-In solders on Cu substrates
Author :
Chen, M.H. ; Jieng, Y.Y. ; Wu, Albert T.
Author_Institution :
Inst. of Mater. Sci. & Eng., Nat. Taipei Univ. of Technol., Taipei
Abstract :
84Sn-3Ag-3Bi-10In and 89Sn-3Ag-3Bi-5In solders were subjected to reflow and solid state aging. The intermetallic compounds that formed at the interfaces between the solders and the Cu substrates and those that formed in the bulk solders in both test conditions were investigated. In the as-reflow samples, the intermetallic compounds were identified as Cu3Sn and Cu6Sn5. After solid state aging, these compounds became Cu6(Sn,In)5 and Cu3(Sn,In). The compounds that formed in the bulk solders were zeta phase, the solid solution of Ag3Sn and Ag2In.
Keywords :
ageing; bismuth alloys; copper; indium alloys; reflow soldering; silver alloys; solders; solid solutions; tin alloys; Cu; Cu3(SnIn); Cu6(SnIn)5; SnAgBiIn-Cu; bulk solders; interfacial IMCs; intermetallic compounds; reflow process; solid solution; solid state aging; Aging; Bismuth; Cities and towns; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Materials science and technology; Mechanical factors; Solid state circuits; Tin;
Conference_Titel :
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3623-1
Electronic_ISBN :
978-1-4244-3624-8
DOI :
10.1109/IMPACT.2008.4783846
